ASME Santa Clara Valley Technical Speaker: January 31, 2013

Come join the Silicon Valley Section of the American Society of Mechanical Engineers (ASME) to host our latest technical speaker!

"Model-Based Data Center Cooling Control" 

Invited Speaker: Dr. Rongliang (Leon) Zhou, Hewlett Packard 

This event is graciously hosted by Electronic Cooling Solutions* 

Pizza and drinks will be provided.
For any questions, please contact: asme.scvs (at) gmail.com.

PROGRAM (all times US Pacific):

• 6:00 PM ~ 6:30 PM: Registration, Networking, and Dinner
• 6:30 PM ~ 7:15 PM: Technical Talk
• 7:15 PM ~ 7:30 PM: Q&A and Networking
• 7:30 PM: Event ends

TALK ABSTRACT:

Real-time cooling control of data centers is a challenging task. On one hand, thermal requirements of the IT equipment with time-varying and spatially non-uniform loads need to be satisfied at any given time. On the other hand, various cooling actuations within the data center, such as supply air temperature and blower speed of the computer room air conditioning units, need to be coordinated to lower the cooling cost. In this talk, dynamic model describing the air flow transport and distribution within the data center is derived from the mass and energy balance principles. The holistic dynamic model captures the causal relationship between various cooling actuations and the resulting rack inlet temperature change, and can be used in such tasks as data center thermal zone mapping, optimization of air flow distribution, and real-time cooling control. The cooling control approach proposed has been implemented in a research data of HP Labs in Palo Alto, and benefits including energy savings, thermal disturbance rejection, and robustness with respect to failures of cooling units have been observed.  

SPEAKER BIO:
Rongliang Zhou is currently a research scientist in Sustainable Ecosystem Research Group (SERg) at HP Labs, Palo Alto. His main research interest is modeling and control of thermal systems and energy efficient systems. He received his doctoral degree in electrical engineering from Rensselaer Polytechnic Institute in 2010. Prior to that, he received a master degree in electrical engineering in 2003, and a dual bachelor degree in electrical engineering and computer science in 2000, both from Xi'an Jiaotong University, China. 

* Ever-increasing power density drives the need for high-quality and cost-effective thermal management resource. Electronic Cooling Solutions is that resource. We use state-of-the-art simulation and measurement tools and employ design and analysis methodologies that can be scaled to address emerging thermal challenges. This leads to a better thermal design.

Electronic Cooling Solutions, Inc. is committed to providing thermal management expertise to the electronics industry. We strive to provide our customers with complete solutions, tailored to meet their technical requirements, so that their business goals will be achieved in a timely and cost-effective manner.